Electronics Forum | Mon May 24 15:50:11 EDT 2004 | Rob
hi all What do you think about soldering pb-free in reflow oven (air) lenght 1,7m (5 zones top,bottom) with max zone temp. 300C? Do you think that this process will be stable? Our max PCb dimension 260x260 mm. When i compare different oven producer t
Electronics Forum | Fri Apr 16 07:34:10 EDT 2004 | Claude_Couture
Ken, thanks for your answer, it is much better presented than what I was fed by our qc. By "calibrating TCs" I meant the readings the controller is displaying on the screen. So that would be the converter that we would check and calibrate. Thank you
Electronics Forum | Mon Jul 01 04:58:50 EDT 2019 | SMTA-David
Hi, I have been looking around for an 8 zone reflow oven with convection heating top and bottom and computer control for setting up and storing profiles. The Chinese company "Jaguar" have a couple of models at reasonable price that look like they wo
Electronics Forum | Thu Aug 29 20:00:32 EDT 2002 | iceman
Steve, I agree, you should expect to have better results from double sided reflow. It is more difficult to dial in a wave solder process for SMT components than a reflow oven. Besides that - adhesive is just no fun to work with.
Electronics Forum | Mon Apr 24 04:23:56 EDT 2006 | TA
Hello guys, I am Looking for a oven with the following specifications. Can any one suggest me the best suitable model. Thanks ========================================================== - heating length 2500mm - zone top/bottom 7 - forced convection
Electronics Forum | Tue Jul 16 02:18:42 EDT 2019 | sy332366
Specifications : S-8800 Number Of Heating Zones :Up8/Bottom8 Dimension (L*W*H)mm: 5310x1353x1490 Dimension (L*W*H)mm: 5310x1353x1490 Number Of Heating Zones : Up8/Bottom8 Length Of Heating Zones : 3121mm Control System : PLC+Computer Transmission Age
Electronics Forum | Thu Jun 27 03:03:57 EDT 2019 | SMTA-David
Hi, I have a small assembly line that consists of a Semi-Automatic Stencil machine, a Samsung Pick and Place, a small IR reflow oven and a wave soldering machine. The reflow oven is presenting the biggest bottleneck. The machine is a small IR (T960
Electronics Forum | Thu Oct 12 08:12:51 EDT 2006 | realchunks
I have, but not for what you are trying. Different ovens and styles react differently when you try this, so you have to experiment to see how far you can go. Why do you think different temps top and bottom will solve the coplanairty issue? Is this
Electronics Forum | Thu May 27 16:23:12 EDT 2004 | davef
Process Trials Procedures. Standard trials are often conducted on reflow ovens by production engineers during product assessment, machine approval or in process set-up. The following trials are also used by machine suppliers during equipment develop
Electronics Forum | Fri Dec 02 01:49:48 EST 2016 | jeya7376
I want to do improvement in conversion time. We running small quantity board and frequently do conversion. we produce very simple board no BGA only resistor, capacitor, LED, IC and transistor. We are running same model top and bottom in 1 reflow oven