Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ
Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
Electronics Forum | Tue Jun 28 18:40:36 EDT 2005 | Bob Gilbert
Matt, Try putting a soldering iron to a pad to see if you get reflow. If it reflows, your oven is too cool. If no reflow, your oven may be too hot. Regards, Bob
Electronics Forum | Tue Jun 28 19:58:59 EDT 2005 | davef
Michael: What's this "tint"? How do you do it? Tell us more, please.
Electronics Forum | Thu Jun 30 20:17:19 EDT 2005 | davef
Matt: What thickness of hard gold was applied to your customer's boards?
Electronics Forum | Thu Jun 30 21:55:33 EDT 2005 | Mason Hughes
Hi, In response to reading height or gold thickness, I can do that masonhughes@sbcglobal.net
Electronics Forum | Tue Jun 28 09:13:46 EDT 2005 | russ
It appears that the reflow profile was incorrect or the paste was in bad shape on these boards from what I can see. I personally have never seen a board finish cause this symptom.
Electronics Forum | Tue Jun 28 10:41:57 EDT 2005 | GS
I am not an expert but just for my understanding: - solder paste used ? NC ? other ? - reflow in Air or N2 ? - temp ramp up before soack (�C/second) ? Tnks GS
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