Electronics Forum | Mon May 01 23:23:58 EDT 2006 | grantp
Hi, I off center idea we used when we started. Get a pasta cooker, and put in vapor phase fluid, and then use that. Place the product in the bottom of the inner pot, and then heat on a small hot plate. When the vapor cloud gets high enough and the
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Mon Oct 05 10:08:54 EDT 2015 | swiese242
I have a HVC 102 reflow oven that will randomly shut down for over/under heat. On the 601 overheat protection zone 4 will read over 500c. Has anyone had this problem?
Electronics Forum | Tue Oct 10 07:30:19 EDT 2017 | spoiltforchoice
TBH I think perhaps the OP deserved it, there is perfectly good explanation of Reflow and Process Window Index on Wikipedia for starters and if you want more all sorts of FREE specialist papers on things like reflowing flex circuit, lead/lead free et
Electronics Forum | Sat Apr 14 03:25:04 EDT 2001 | kpliew
Hi , As far as I experienced with wave reflow. If u have a refective thermal reader , u will see that the board is exposed to much more temp than the 120 deg that u set. Actually , once u see the board warp or comp. crack u should know that
Electronics Forum | Sat Apr 14 03:25:10 EDT 2001 | kpliew
Hi , As far as I experienced with wave reflow. If u have a refective thermal reader , u will see that the board is exposed to much more temp than the 120 deg that u set. Actually , once u see the board warp or comp. crack u should know that
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef
First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s
Electronics Forum | Thu Oct 12 12:22:52 EDT 2000 | stefano bolleri
This is a question about LCDs (Liquid Crystal Displays) packaged as SIPs or DIPs. My question is: can they be wave-soldered? I found process recommendations on Web pages of several LCD suppliers, and they pretty much all say that LCDs should NEVER be
Electronics Forum | Fri Dec 27 12:53:38 EST 2019 | rgduval
yeah...I never had airflow volume problems with Hellers. When I had to build the system I was referring to, we had an old Speedline oven, and the way it was configured if you didn't provide enough airflow to the outer cavity, the blowers would overh
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