Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik
Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P
Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Mon Apr 11 06:37:59 EDT 2005 | amstech
As long as you have a continuous profile with required soak and dwell periods, the zone lengths do not matter. For lead free, usually ramp to peak is preffered.that is with minimum soak (you can not avoid soak anyway. You can achieve the profiles irr
Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi
Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th
Electronics Forum | Mon Aug 25 22:14:34 EDT 2003 | davef
You need a nylon with a heat deflection temperature [heat distortion temperature] - 0.45MPa ( C ) similar to your reflow peak. The HDT of the nylon in your connector is probably ~200*C. For more, look here http://www.tycoelectronics.com/environment
Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1
I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that
Electronics Forum | Mon Mar 25 16:40:17 EDT 2013 | rrpowers
I have a customer that is wanting to use a low-temp solder paste such as SnBi for a lead free circuit, however they are specifying PET for the flex circuit. I have always used polyimide for SMT reflow due to the temperature limitations of polyester.
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
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