Electronics Forum | Mon Aug 13 16:12:10 EDT 2007 | judym
Thanks for your input........When my guy gets in tomorrow I will pass on the info....
Electronics Forum | Mon Aug 13 18:17:44 EDT 2007 | chrisgriffin
Glue is good....
Electronics Forum | Thu Apr 22 14:15:35 EDT 2004 | russ
Well so much for being too hot! Try kicking your max temp up to 220, I wouldn't extend the duration however. I would almost start to think that this QFP has a pb free finish. Let us know what happens Russ
Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry
I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?
Electronics Forum | Mon Aug 13 08:00:46 EDT 2007 | davef
Are the components that fall from the board solderable? Is the board solderable? Where is the solder for the components that fall from the board [eg, on the pads, on the component]?
Electronics Forum | Wed Jan 07 13:17:56 EST 2004 | James
We currently have 2 HVA 102 conceptronic reflow ovens. I ran 2 profiles on the 2 seperate machines. One of the oven ran 7 degrees lower than the other oven. I checked all the fans and they seem to running fine. I get no warning on the monitors.
Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym
When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no
Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry
Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which
Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron
Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m
.gif)
winsouce.jpg)