Electronics Forum | Tue May 28 11:42:06 EDT 2002 | anthonyb
Jim, What are the limitations of the intrusive reflow process?
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Fri Dec 03 03:06:45 EST 1999 | Charley Qin
Is there a generally acknowledged loading interval of PCB for Reflow proces?
Electronics Forum | Mon Jan 25 20:39:27 EST 2010 | aungthura
Dear all I hope someone could have very useful idea for sockets soldered by machine either Reflow or Vapor.And, kindly advise me. Thanks in advance.
Electronics Forum | Wed Jul 11 22:44:50 EDT 2012 | joeion
Why cannot reply????
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Fri Jul 06 05:28:59 EDT 2012 | jsolloway
..... that's very strange. If there were any risk of de-lamination then it would of occurred during the reflow process, surely. Unless the through hole department are using heat guns or wave sodler? I doubt if the sales or planning team are happy if
Electronics Forum | Fri Dec 03 18:27:09 EST 1999 | Dave F
Charley: As Wolfgang says, you're unlikely to be able to put enough (average) boards in a modern reflow oven to be able to thermally load the machine. Ta Dave F
Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Electronics Forum | Tue Dec 07 21:28:00 EST 1999 | sosina outry
I had read all three reply to the interval of pcb in the reflow process already. Like Wolfgang said, base on the profiling and the temp that you set in there. The interval will be base on that temp. Some might have a gap of one pcb lenght, some mig
