Electronics Forum | Fri Jun 03 14:55:15 EDT 2005 | Bman
Both our Quad ZCR and our Conceptronic HVN-102 ovens have had blowers out with no alarms raised. We knew there were problems based on how boards were soldering, but don't count on your oven to tell you if anything is wrong with it. We verify once a
Electronics Forum | Tue Jan 23 17:16:07 EST 2007 | darby
Check out the web sites of the major solder manufacturers. From a quick glance most of the pastes around that temperature range have problems with Zn content and may not be available as pastes???? Depending on your application, some of the lower melt
Electronics Forum | Fri Jun 03 10:15:14 EDT 2005 | PWH
We do both our ovens once a week. If something looks out of tolerance (we've developed acceptable tolderances based on many recorded profiles over time and oven mfg. specs.) we wait a couple hours and try again. The recorded data over time is very
Electronics Forum | Sat Jun 04 15:06:20 EDT 2005 | slthomas
After profiling with a scrap board of the product I'm profiling, I would immediately send the MOLE through with one thermocouple only, no board, to provide a standard that I could reproduce without depending on scrap boards. I used that setup before
Electronics Forum | Fri Jun 03 09:00:06 EDT 2005 | russ
How many times have you found that your oven was performing differently? this will give you the answer on frequency. We have a dedicated board and profile that we use to verify the oven operation. We perform this every 3 mos. and I believe that th
Electronics Forum | Fri Jun 10 12:11:49 EDT 2005 | chunks
QS and ISO can really play a part here. If so, the best way I found was to run parallel T-couple ports to the thermocouples of the oven. Now you can run a board and gather all your thermal information and set your temps. Now use parallel ports to
Electronics Forum | Wed Apr 21 17:27:27 EDT 2004 | russ
We always use the regular production reflow profile when we use this method. Since you don't want to do that, All that is required is to ramp the part up to temp to get the balls to melt. If you don't exceed 2C per sec. in a ramp you will be fine.
Electronics Forum | Wed Apr 21 19:59:43 EDT 2004 | Ken
It makes no difference if the solder is in balls, ingots, bars, paste etc. The thermal profile satisfies key areas of the reflow process as a function of your flux and alloy type. Peak and duration above liquiduous are a function of the alloy. pr
Electronics Forum | Thu Apr 22 18:02:04 EDT 2004 | davef
Could you be looking for this: http://www.assemblymag.com/CDA/ArticleInformation/features/BNP__Features__Item/0,6493,108063,00.html
Electronics Forum | Thu Apr 22 20:49:01 EDT 2004 | bunmiog
... or this http://www.smtnet.com/express/199908/bgarework/index.cfm?cfid=40896&cftoken=34317412
