2 reflow profile allowed if component heat allowed 235 results

Electronics Forum: reflow profile allowed if component heat allowed 235 (Page 1 of 1)

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Re: MicroBGA qualification process

Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F

Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so

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