Electronics Forum | Tue Jun 14 18:32:44 EDT 2005 | GS
Hi Peter, which should be the best cooling rate once belove TAL by using L-F alloy ie. SAC 305 ? Tnks GS
Electronics Forum | Mon Jun 20 21:54:38 EDT 2005 | darby
Contact your paste supplier and see what they say. My information on SAC 305 FROM MY SUPPLIER was - "The cool down rate is not as critical for Pb-free solder joints, as it was for SnPb. The grain sizes do not differ is size in the Pb-free bulk solde
Electronics Forum | Tue Feb 19 09:24:25 EST 2019 | cyber_wolf
Reflow profiles are based on the product and materials you are soldering. You need profiling software and a data logger.
Electronics Forum | Thu Aug 24 08:59:38 EDT 2000 | Eugene Smelik
Dr. Lee, For Pb-free solders, will the reflow profile be similar to that of Sn/Pb, with an flux activation plateau before going to peak reflow, or will the profile be more linear in nature? Are there advantages/disadvantages to either profile for P
Electronics Forum | Tue Feb 19 08:41:02 EST 2019 | prasanth
dear experts, i want your suggestion for getting a profile in Heller 1707 mk iii series re-flow machine ,its 7 zone machine recently we had a solder ability issues , so pls guide me ,how to set rts profile parameters
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Tue Oct 09 15:02:46 EDT 2001 | bobm
THE PEOPLE THAT MAKE THE PROFILING EQUIPMENT IS. ECD. THERE WEB SITE ADDRESS IS http://www.ecd.com THE CONTACT THERE IS OPAL HILL. PH# 800-323-4548 FAX# 503-659-4422 E-MAIL opal.hill@ecd.com sorry i got companies confused.
Electronics Forum | Tue Feb 19 08:57:43 EST 2019 | prasanth
hello experts if you had anyone rts and rss profiles HELLER 1707 MK III series 7 zone machine pls forward me prasanth
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