Electronics Forum | Thu Oct 05 16:06:33 EDT 2006 | cw
Thanks! What's your ramp rate?2 - 3C/sec? What's your time above 217C. What's your peak temp?
Electronics Forum | Fri Oct 06 08:24:01 EDT 2006 | inds
CW, make sure your customer is aware of the affect high temp might have on adjacent components on the board. I guess you must have already checked out the rated temperature of all the components on the board
Electronics Forum | Tue Jan 14 10:48:07 EST 2020 | dontfeedphils
I've worked with these quite a bit in the past as well. As the previous poster mentioned, we ran either 4/5 mil thick stencil with a pretty standard RTS profile in a 10 zone convention oven without issue.
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Tue Jan 14 10:41:49 EST 2020 | robl
Hi Arnel, I've used these before but with a 0.005" stencil. The key issue here was that the pins are actually a solder preform at the base that melts into the board - sort of BGA like, so too much paste can cause issues. Samtec have some great app
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Tue Jan 14 17:22:16 EST 2020 | emeto
Avillaro, would you say that vapor phase process was selected, because the boards are so thick and heavy? I would assume so. Have you ever tried to run them through reflow oven? To understand better your challenge, we need to understand the setup be
Electronics Forum | Wed Jan 15 10:31:55 EST 2020 | emeto
Having 10c thermal differential is a lot. Trying different paste might help - usually thermal expansion makes component detach from PCB, then joint is formed and solidified, then component goes back but is too late to form a joint. Cooling speed migh
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
