Electronics Forum | Wed Oct 04 15:06:57 EDT 2006 | C.K. the Flip
Hmmm.. you are in a pickle then. I have AIM's "Reflow Profile Supplement" where they recommend a Low-Long-Soak (LSS) profile for situations like your's. It's an old-school type profiling approach where you ramp up to 120*C for about 1 min. then soa
Electronics Forum | Mon Apr 16 18:49:40 EDT 2012 | tris101
Hi guys, I'm looking for some tooling parts and I hope you can point me in the right direction. We design basic in house reflow Carriers to surport boards during reflow. I would like to add clamps to our designs but I can not locate any off the she
Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Wed Oct 04 16:14:17 EDT 2006 | inds
what is your peak temp.. if you try to go too high say 225-230 deg C there is a fair chance of seeing voids.. depending on your ball size and paste volume you can get a good collapse at temps below 225deg C...
Electronics Forum | Thu Oct 05 16:12:09 EDT 2006 | Mario Scalzo, SMT CPE
* Try 1.5C / sec from RT to 165C * Hot soak at 165-175C for up to 2 minutes (I'd start with 60 seconds flat soak.) * 60-90 seconds TAL (I's start with 60) * 230-240C Peak. Thanks, Mario
Electronics Forum | Fri Oct 06 15:43:33 EDT 2006 | Mario Scalzo, SMT CPE
What I usually do is keep the peak temperature about 5-10 deg C below the peak temperature of my lowest rated component, then set everything else up around that. Worse case scenario is to just extend the time above liquidus (TAL) in 5 second increme
Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG
We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p
Electronics Forum | Wed Apr 25 14:41:13 EDT 2012 | davef
Try: Equipment, Sldr pallet hdware clips * Summit Precision 5825 S 25th St, Phoenix AZ 85040 Dennis Miller 602-268-3550 summitprecision.com sales@summitprecision.com * Southco 210 N. Brinton Lake Rd, Concordville, PA 19331-0116; 610-459-4000 southco
Electronics Forum | Fri May 04 16:22:21 EDT 2012 | wesm91229
Hi Tristian, I work at the 1st company listed- the link you posted is our website. We have updated our clamps for those type of SMT process carriers. Feel free to email me @ wmartin@gscusa.net or call 972-494-1911 and I can help you out. Sorry for
