Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Wed Jan 15 11:53:40 EST 2020 | avillaro2020
As far as the large thermal gradient I have on my thick and thermal heavy board, I've done quite a bit to minimize the gradient but not successful. it's like one pad is connected to a signal while the other pad is connected to ground, you can't bring
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef
Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Fri Feb 21 04:52:59 EST 2003 | Neil
Is anyone producing products using intrusive reflow soldering????
Electronics Forum | Sat Jun 27 10:45:18 EDT 2020 | SMTA-Davandran
Hi Indhu, Check for solder paste height. Please manually add solder, mount component and reflow.
Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef
I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.
