Electronics Forum | Mon Aug 13 08:00:46 EDT 2007 | davef
Are the components that fall from the board solderable? Is the board solderable? Where is the solder for the components that fall from the board [eg, on the pads, on the component]?
Electronics Forum | Wed Dec 08 20:15:25 EST 2010 | davef
What is the solids content of your solder? 50%??? Then, theoretically, if the aperture is 1:1, you'll have 2 thou of solder on your pads.
Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Tue May 07 22:25:15 EDT 2002 | L_ch
Hello, As you know for the double side assembly PCBs, we normally first place the bottom side, then place top side after reflow soldering of bottom side. are there any other considerations for the sequence of reflow soldering ( bottoms side first, to
Electronics Forum | Fri Feb 21 08:41:06 EST 2003 | davef
Yes. Reflow soldering PTH components goes under different names. * SMTnet's friend Bob Willis popularized the "intrusive reflow soldering" term. * Jim Blankenhorn, another of our friends, and others popularized "pin and paste". * Still others use
Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Thu Jan 16 17:54:12 EST 2003 | Ren�
Hi burb , reflow temps are same than other profiles just follow your solder paste recomendations , Will help you a lot a solder paste with Silver , or if you want to eliminate completely the granular looking , use nitrogen with your oven ( You will s
Electronics Forum | Sun Feb 06 12:04:06 EST 2005 | ddhanashekar
can some one give me some suggestion to solve the problem. we are using cooksun/alphametal rma9086 paste for our screenprinting. after the reflow we see lot of solder ball on the board. we have maintained the exact profile given by the manufacurer. w
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
