Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Thu Jan 21 03:09:05 EST 2010 | aungthura
I have tried to solder sockets by reflow machine. but, failed because sockets were deformed after reflow.Has anyone had some advise for me?
Electronics Forum | Fri Jan 22 08:25:18 EST 2010 | davef
This socket supplier never expected you to do what you're doing to his/her part. Some materials bear-up under the thermal strain of reflow solder than others. Try different socket materials.
Electronics Forum | Fri Jun 26 14:08:49 EDT 2020 | indhu
Hi, I am having a issue that SMT nut drop after reflow. The solder height all in specifications. Had tried adding flux inand the solder paste. But shows no improvement. Is the nut easily oxidize? Can anyone help me on this?
Electronics Forum | Mon Mar 29 11:15:58 EST 2004 | davef
Grant & JDumont: You should not have this white residue on your wave soldered connections, using VOC flux [but you know that, anyhow]. Applying too much flux is the likely cause. Other possibilities are: * flux contamination * solder contamination
Electronics Forum | Tue Mar 30 07:20:20 EST 2004 | davef
If you can rub it off, it's unlikely to be a solder mask problem. Try the "excess flux, flux contamination, solder contamination" angle.
Electronics Forum | Mon Oct 12 14:30:58 EDT 2015 | duchoang
Hello Eniac, 1/- Insufficient solder paste, check your print (Printer/Stencil). 2/- If you've got good paste deposit, that could be contaminated pads causing poor solderability. Good luck.
Electronics Forum | Thu Jun 02 14:57:36 EDT 2011 | davef
We don't expect properly soldered first-side DPAKs to fall from the board during second-side reflow. The ratio of weight to solder surface area for a DPAK is 1.32 gm per in^2, which is well within the limit of 44 gm per in^2. [Search the fine SMTnet
