Electronics Forum | Thu May 09 16:04:07 EDT 2002 | stownsend
The lighter the component, the more likely it is to stick to the solder on the bottom reflow side. All boards I have worked with, the descrete components (R's and C's) are placed first (bottom side), reflowed, then the active components (IC's) are pl
Electronics Forum | Fri Jun 26 14:27:51 EDT 2020 | victorzubashev
Hi Indhu, It could be multiple reasons but probably one root cause. metal nut might require reflow profile change- you need to check it with SMT reflow profiler. the part might be oxidized - you can check solderability or try to solder part using a
Electronics Forum | Tue Sep 02 22:03:03 EDT 2008 | davef
Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html
Electronics Forum | Thu Oct 03 04:04:10 EDT 2002 | Bob Willis
SMTNet has a video tape and interactive CD ROM on Intrusive Reflow Soldering that you may want to check out. In addition there are some free inspection standards for pin in hole printing, placement and soldering available at http://www.dpmo-monitori
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Tue Sep 22 08:35:47 EDT 2009 | cman
Did you try pre-tinning your board on this suspect pad/s to see if it improved wetting/solderability prior to printing/SMT placement and reflow? Does the pad/s not soldering tie to a ground layer? I would connect a T/C to each pad of the same part an
Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Tue Mar 30 02:58:55 EST 2004 | Grant Petty
Hi, Thanks for the ideas. With the solder mask curing problems, can you normally wipe off the white residue, as we can do this on our boards with our fingers. It's almost like the surface of the board has a "wet dried up" look to it, and it's a smok
Electronics Forum | Wed Aug 09 12:22:11 EDT 2006 | Rob
You are going to struggle with that sort of connector - the only pin headers that seem to have widespread sucess are the dual inline ones with bent over j leads that sit on the board. They come with a plastic hat that allows vacuum pick up. However
