Electronics Forum | Mon Apr 07 15:22:17 EDT 2014 | garym4569
Found the issue. The footprint is incorrect. The inductor completely shields the paste from heat. Slid the inductor on the pad to expose the pad and paste, and perfect solder joint. This part was a last minute design change with a larger body.
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Fri May 14 16:49:17 EDT 2021 | winston_one
Agree with WiIIR and also can recommend to play with vaccum pump RPM . Slower vacuum increasing have help me to resolve one problem caused by the vacuum (it was solder splash from BGA balls, but the reason can be similar to your case). Also check i
Electronics Forum | Mon May 24 15:50:11 EDT 2004 | Rob
hi all What do you think about soldering pb-free in reflow oven (air) lenght 1,7m (5 zones top,bottom) with max zone temp. 300C? Do you think that this process will be stable? Our max PCb dimension 260x260 mm. When i compare different oven producer t
Electronics Forum | Sun Mar 25 17:02:41 EDT 2007 | johnwnz
Folks, I may be havign a thick day, it is Monday afterall and it has been very sunny over the weekend. We have recently started buildign a fairly high volume of products that is using intrusive reflow on two PTH DIN connectors and havign soem good s
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
