Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Mon Jan 25 20:39:27 EST 2010 | aungthura
Dear all I hope someone could have very useful idea for sockets soldered by machine either Reflow or Vapor.And, kindly advise me. Thanks in advance.
Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef
I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.
Electronics Forum | Wed Aug 09 04:20:19 EDT 2006 | Rob
If you kink the leads will you be able to insert it without flexing the board/moving any of the other components? Also these pin headers aren't always designed for this process so have you checked that it will take the elevated temperatures?
Electronics Forum | Mon Jan 25 04:25:49 EST 2010 | aungthura
Thanks Davf that socket we couldn't change since the customers supply these sockets.we can contro only our process.
Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL
Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im
Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave
Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t
Electronics Forum | Wed Aug 09 01:58:51 EDT 2006 | tk380514
OK i have a question: I have a prototype BOM and i suggested the customer that we use Paste-in-hole for the 1 connector that they want to use, but its quite high component and not very wide: http://www.molex.com/pdm_docs/sd/022272051_sd.pdf If i u
Electronics Forum | Wed Aug 09 07:32:11 EDT 2006 | mumtaz
The curled legs may push the paste out of the hole, making things messy. This also will decrease your volume of paste which means your solder joints are not as robust as you would like. Also with this process, voiding can be a big issue depending o
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
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