Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
Electronics Forum | Tue Jul 16 02:18:42 EDT 2019 | sy332366
Specifications : S-8800 Number Of Heating Zones :Up8/Bottom8 Dimension (L*W*H)mm: 5310x1353x1490 Dimension (L*W*H)mm: 5310x1353x1490 Number Of Heating Zones : Up8/Bottom8 Length Of Heating Zones : 3121mm Control System : PLC+Computer Transmission Age
Electronics Forum | Wed Oct 10 07:01:05 EDT 2007 | jdumont
I agree, I have been doing this for years also. Never found anything that the oven wasn't already telling me. I will however be investing in the KIC 24/7 constant monitoring device soon. Price isn't too bad for what you get. Customers like to get a w
Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon Apr 14 20:13:40 EDT 2014 | davef
So, someone is going to get a chance to buy a nice and shiny oven, eh? Summary from my notes of old thread on SMTnet: Some people melt sugar and use that solution to clean cooked-on flux residue. Dissolve sugar into warm water, spray it on the area t
Electronics Forum | Thu Jun 28 15:38:37 EDT 2012 | davef
Matthew: That you can get solder flow when hand soldering, but not when reflow soldering, seems to be telling you that you're not getting the connection warm enough during reflow. You need to have those connections liquidous + 20*C for at least 5 sec
Electronics Forum | Thu Aug 18 13:11:39 EDT 2005 | jsloot
We have our board house apply a peel coat mask that can be brushed off after wave or reflow. You need to brush off while it's still warm.
Electronics Forum | Sat Oct 19 04:24:56 EDT 2019 | SMTA-Davandran
There is double sided adhesive that able to withstand high temperature during reflow. `keep the adhesive minimum and appropriate location for securing the FPC on pallet during entire SMT process and easier for release of FPC after reflow process. Tak
Electronics Forum | Tue Jan 25 07:49:17 EST 2005 | davef
On "Solder beading seemed to be a problem", consider revisiting the thermal recipe used for reflow. The PTH barrel may not be getting warm enough. On "Component not being designed to pin in paste work, with no proper standoffs", consider: * Using a
Electronics Forum | Thu Jun 21 12:05:54 EDT 2001 | brownsj
I used to assembly 0402 devices on to a double sided PCBA using a 96% tin 4% silver alloy. This material printed fine but the higher processing temperatures did present a problem. This material had a melting point of 221 deg C which required a peak r
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