Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Thu Nov 11 10:09:06 EST 2004 | D.B.Davis
Dear Colleagues, I am working with a new prototype product that is presenting some interesting problems. My Engineering Dept. has made some suggestions that I find a little odd. I am looking for some confirmation from fellow SMD personnel as to the
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin
Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that
Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Tue Aug 25 17:49:15 EDT 1998 | Earl Moon
| Hello, | Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal e
Electronics Forum | Tue Oct 26 13:40:47 EDT 2004 | Paul_pmd
Have the SOIC tested by independant. Clarify as to weather or not you have run this board before. Check to see if the board has been rev'ed. Sometimes IC's are rated at a clock speed or by axcess time. Engneering on this board may be at the tolorance
