Electronics Forum: reliability (Page 13 of 241)

Temperature cycling

Electronics Forum | Tue Apr 09 08:27:55 EDT 2002 | davef

Read SM-785 - "Guidelines For Accelerated Reliability Testing Of SM Solder Attachments"

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef

See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th

BGA Reliability

Electronics Forum | Sun Jul 28 15:29:06 EDT 2002 | davef

There's background and links to papers on black pads in the fine SMTet Archives.

Pinhole Solder Joint Reliability

Electronics Forum | Wed Jul 23 06:54:06 EDT 2003 | davef

100 sec) and decrease reflow temp to 205C.

BGA Thermal Cycling Tests?

Electronics Forum | Wed Nov 19 22:39:10 EST 2003 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments

Immersion Silver Reliability / Peelable mask

Electronics Forum | Thu May 27 08:04:15 EDT 2004 | davef

Contact the licensers of imm silver process, mentioned earlier in this thread.

Immersion Silver Reliability

Electronics Forum | Tue Jun 08 09:12:04 EDT 2004 | davef

Try: Dennis Fritz; MacDermid; Waterbury, CT; 203-575-5740 ddfritz@aol.com

Lead Free Solder Reliability Issues in Military and Aerospace

Electronics Forum | Wed Jan 26 16:25:33 EST 2005 | patrickbruneel

Amen Dave

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Wed Jun 08 12:14:58 EDT 2005 | patrickbruneel

Could you describe the problem you encounter

Temperature testing

Electronics Forum | Wed Jul 20 07:11:34 EDT 2005 | davef

SM-785 - Guidelines For Accelerated Reliability Testing Of SM Solder Attachments What is the goal of this temperature testing?


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