Electronics Forum | Sat Jan 15 21:52:15 EST 2000 | Dave Bartlett
I am looking for information comparing the reliability of smt boards vs thru hole boards. Also, information on when to use thru hole instead of smt if there is such a case. Background - We currently make temperature controller with a mix or smt and
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C
| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Tue Feb 28 07:47:33 EST 2006 | davef
The key driver to aperture design is to assure a fillet of the proper height for the component temination and the reliability of the end-product customer use environment.
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
Electronics Forum | Thu Oct 24 01:10:54 EDT 2002 | pizz
thank ur kind help. the above two processes,which is more reliably,other words,robust? I am in a dilemma. some suggest that 50 pins is the critical point,once exceed the quantity,the hand soldering is not practical. I prefer to two sides reflow.but
