Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef
We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes
Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on
Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef
Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i
Electronics Forum | Sun Nov 15 23:40:59 EST 1998 | emori
Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.
Electronics Forum | Mon Nov 16 08:50:04 EST 1998 | Larry Johnson
I don't really no much of any problems other then, be sure that the BGA avoids moisture. If the BGA has moisture inside of it when it across the wave. Due to the heat, the moisture will evaporate and cause shorts inside the BGA. Now if someone can
Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
