Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Sun Feb 01 15:07:10 EST 2004 | rick
Pete C Thank you for answer. Yes we have to remove solder flux so we need chemistry for no-clean flux residue. What kind of damage can i expact from ultrasonics device? you said damage IC and clock types?. We have all components in solid encapsulat
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Wed Nov 14 20:30:26 EST 2001 | davef
Tks. So was the answer that you got close? [ala "Car Talk"] Some guy from Cal-fornie sends me spill. I get cigars from � Yeh, I know I hog the responses, but I learn by doing this. If I can communicate in print, I can better communicate in word
Electronics Forum | Tue Jun 13 19:58:33 EDT 2006 | davef
Team Services: Removing IC markings * methylene chloride to remove the markings * xylene and toulene will also remove some paints * "Black boxing" Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. Chris: Sand
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet
All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p
