Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto
Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml
Electronics Forum | Thu Feb 26 13:29:36 EST 2015 | swiese242
Use the appropriate heat for that part. You can then use techspray flux remover with a brush. Spray the brush, and not the board, to reduce spreading the flux. Acetone or alcohol are less expensive and may work as well.
Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis
Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t
Electronics Forum | Sun Feb 22 15:46:09 EST 2015 | slave2anubis
Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone,
Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach
| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez
1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.
Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
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