Electronics Forum | Tue Jul 26 08:57:23 EDT 2011 | indyc
I am trying to rework FP4531 underfill. Some of the underfill flowed to adjacent capacitor and resistor. Even though the datasheet says that it is non-reworkable, has anyone tried reworking / removing excess underfill? Any information would be help
Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto
Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml
Electronics Forum | Tue Apr 27 15:09:48 EDT 2004 | zymet
Hello Ron, Successful removal of an underfilled BGA requires the use of a reworkable underfill, which Zymet manufactures. For more information on such products, send an inquiry to info@zymet.com. Regards, Carol
Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera
My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have
Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef
With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef
Electronics Forum | Fri Mar 28 10:11:31 EDT 2014 | davef
hege: beer can opener!!! The ultimate multipurpose tool ... BR davef
Electronics Forum | Fri Mar 28 16:27:43 EDT 2014 | hegemon
Lol Dave. Give me a lever long enough....
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef
Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.
