Electronics Forum | Wed Feb 14 16:00:50 EST 2018 | cbart
We have used it,, mixed results, cleans well, but can as you would imagine destroy plastic, i've had operators soak product and that caused problems, it also destroys any marking labels. we also use different Saponifiers to remove residues in the pas
Electronics Forum | Mon Aug 21 09:11:30 EDT 2000 | Eric Soderberg
Currently use Hysol TS300 latex mask and need to explore alternative methods of drying the mask. The mask is applied with a Asymtek Century Dispenser and placed on drying shelves. Air dry is dependent on temperature/humidity. Tried all the UV masks o
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet
All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p
Electronics Forum | Tue Jun 13 19:58:33 EDT 2006 | davef
Team Services: Removing IC markings * methylene chloride to remove the markings * xylene and toulene will also remove some paints * "Black boxing" Simply use a tiny piece of sandpaper to "scratch the surface" and render the device blank. Chris: Sand
Electronics Forum | Tue Feb 03 15:14:58 EST 2015 | stevezeva
This is a late reply, but from my experience a really good removal station is one made by a company called CCRCo. They make a micro-abrasive station that addresses all the ESD concerns. They utilize a reusable media that is really cost effective. The
Electronics Forum | Tue Jun 13 16:20:27 EDT 2006 | flipit
Sandlast, laser, or pad print over existing marking
Electronics Forum | Mon Jan 14 23:02:52 EST 2008 | davef
You don't mention any particular IC or manufacturer or marking method. However, most IC marking is done with lasers these days. The laser actually alters the encapsulation so the only way to erase the marking is to remove the encapsulation. Otherwise
Electronics Forum | Mon May 22 11:22:34 EDT 2000 | Pierre
Does anybody use a material which is repairable (removable chemically), low curing time (UV), masked areas cured, solventless, used with Nordson equipments ?
Electronics Forum | Fri Apr 17 14:08:00 EDT 2015 | davef
Humiseal says, "UV cure – These materials are also more difficult to repair as they are the most chemically resistant and mechanically tough of all conformal coatings. Removal is possible locally by using powder abrasion."
Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1
Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i
