Electronics Forum | Thu Sep 25 17:35:28 EDT 2003 | denis
To be precise, the component is a Xilinx Virtex platform FPGA with 1152 balls. We also assemble some DSPs up to 1000 balls with metal cover. At best, we can remove the components but it is almost impossible to find a working solder profile using IR.
Electronics Forum | Tue Jun 20 00:31:18 EDT 2006 | Frank
I, too, would bend it 90-degrees prior to assembly and I would also put on a little spring loaded, removable, heat sink on to the wire to stop the heat transfer up the wire. After the wire is soldered, then remove the heat sink. Try the one from Ra
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Sun May 02 18:44:26 EDT 1999 | JohnW
| | How's the "Great Gas-out" going for ya'll? | | | | Myself, I'm doing real good! Haven't farted all day...(GRIN) | | | | Anyways, a thread got started down below about this so-called "Lead Free" stuff, and I just wanna' put my two cents in about
Electronics Forum | Wed Nov 29 00:43:45 EST 2006 | callckq
Dear all, Recently, we run 2 models with heat sink attachment on top of this BGA(on top of this BGA, there is flip chip attached at the center of the BGA). Hence, the center of the BGA is higher than corner/side. We used conventional way to attach
Electronics Forum | Tue Sep 12 16:53:58 EDT 2006 | stepheniii
Make sure you desicate the boards if they have MSDs on them. I'm guessing you have a part on the board you want removed, but can't do it normally. At one time I thought it might be slick to make a spring loaded Kapton tape "tent". The idea being th
Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL
vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c
Electronics Forum | Thu Jul 20 12:19:24 EDT 2000 | Dave F
Bob: Techniques for removing RFI / RF shields vary according to the size and type of shield. Removing: * PTH RFI / RF shields is as straight forward as the next heat sinking PTH component, often using a solder bath or fountain. * Small SMT RFI /
Electronics Forum | Wed Jul 01 04:54:28 EDT 2015 | jvercamm
hi, the last post on pad cratering dates from 2012. We have (likely similar) problems with a RoHS 783 solder ball BGA size 29x29mm^2 (organic package BT), pitch is 1mm and solder ball diam is 0.5mm the field failure is after 12 months, almost exclu
Electronics Forum | Thu Jul 29 11:58:06 EDT 1999 | Greg Jones
| | | | Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | | | | | | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead e
