Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Fri Feb 20 08:56:42 EST 2004 | davef
We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently. Use ion chromatography testing to be sure it is clean under the BGA. IC is the on
Electronics Forum | Fri Mar 04 17:19:31 EST 2005 | davef
Mrduckmann2000: Why do you want to do this? * Removing a non-washable / peelable temporary solder resist [TSR] is going become very tedious, because they do not release well from small / tight / isolated features. * Clay from washable resists will
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Fri Jun 05 13:06:14 EDT 1998 | Steve Schrader
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Fri Jan 08 10:07:26 EST 1999 | Chrys
| I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). | The one problem I still have is cleaning the wave solder carrier's to remove the no clean
Electronics Forum | Mon Jan 18 19:53:58 EST 1999 | Rob F
| | I'm in the process of moving from water washable flux to a full no clean process for the wave soldering process, thing's seem to be going well (so far...). | | The one problem I still have is cleaning the wave solder carrier's to remove the no cl
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Sun Sep 09 02:24:04 EDT 2012 | audere
More lube on the O-Rings caused lots of problems. Nozzles would drop downward at times. So I pulled everything out and started from scratch. Testing 3 new Z-Rods, 4 used Z-Rods in good shape (replaced the O-Rings) and around 20 nozzles - the proces
