Electronics Forum | Thu Sep 04 05:18:45 EDT 2014 | sasa29
PCB Manufacturing demands preparation of design well in advance. The finalized designs are fed into the systems and the production is carried away. If the boards are of small sizes, multiple boards are made on a single large board and separated into
Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Electronics Forum | Wed Nov 07 12:52:25 EST 2001 | burg5566
I am currently doing a research project for a College class and was curious if anyone had seen or is currently not using silkscreens on their PWB\PCBs. If so, what type of a repair process do you use?
Electronics Forum | Wed Nov 07 18:54:40 EST 2001 | burg5566
kettering university in Flint, Michigan
Electronics Forum | Mon Mar 09 15:03:41 EDT 2020 | davef
snip from https://hackaday.com/2020/03/09/pcb-finishes-hack-chat PCB FINISHES HACK CHAT No comments by: Dan Maloney March 9, 2020 Join us on Wednesday, March 11 at noon Pacific for the PCB Finishes Hack Chat [https://hackaday.io/event/169956-pcb-
Electronics Forum | Wed Nov 07 17:06:56 EST 2001 | davef
Most of us, here on SMTnet, are either assemblers or sale types. Assemblers use stencils [metal foil, secured in a frame] instead of silk screens. Fabricators use silk screens in various photoimaging processes for applying etch resists, solder mask
Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Fri Nov 24 22:32:12 EST 2017 | myke03o
Some Customers normally don't share CAD data in order not to copy the design. What you can do is use the Pick and Place file then plot to the pcb paste/silkscreen layer of the gerber using software. Not sure if your universal machine can load a gerb
Electronics Forum | Wed Apr 16 21:00:50 EDT 2003 | yukim
Hi Dave, thanks! The peak temp on the terminal device is about 210C. Some more questions: The soldering part of the terminal is about the same size as the PCB pad. We observe a lot of voids when we remove the terminal device, whice can be removed v
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
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