Electronics Forum: removing tarnish from pcb component leads (Page 1 of 51)

removing solder from a 0.015" hole

Electronics Forum | Wed Feb 26 18:48:01 EST 2003 | kennyg

I'm trying to solder a 0.011" lead into a 0.015" +/-0.003" hole. Stop laughing please. This is normally possible with difficulty, except if the lead is removed and the attempt is made to re-install a lead. Anyone have thoughts on how to remove nea

pcb component defect

Electronics Forum | Fri Oct 21 11:30:56 EDT 2011 | remullis

Thanks I got some coming from BRADY. These will have to be removed. Anyone ever needing the part # its, BIA-RD 2.00 bucks a sheet.

Re: Non soldered leads on ic's

Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson

| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o

Re: Detecting lifted leads on QFPs

Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW

| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect

Re: Detecting lifted leads on QFPs

Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F

| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect

Re: Tinning gold plated leads ( DIP, etc)

Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F

John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 19:52:25 EST 2002 | kennyg

Problem: A SMT fine pitch or BGA component needs to be baked due to MS concerns and is needed in a hurry. In some cases the packaging will not allow a high temp/short duration bake. Production will not allow a low temp/long duration bake. If the part

raised component measurement

Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg

Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf

SN/PB soldering with gold plated pcb

Electronics Forum | Tue Apr 26 15:21:11 EDT 2005 | russ

Sounds to me like they are thinking since they have a gold board that it must be processed lead free. This kind of thing is happening all over since OEMs are starting to think about pb free and sending their purchasing and engineering to these semin

BGA pads lifting from PCB

Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135

I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke

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