2140 repair & tombstone results

Electronics Forum: repair & tombstone (Page 1 of 214)

solving tombstone

Electronics Forum | Thu Jul 31 23:52:12 EDT 2008 | roc2x

Hi, Im having problem on tombstone, The part is LF chip component 1005, and my solder paste is WS leded. tombstone is not in a deg angle but one side is soldered but the other side is just sitting on the solder. Looks like my solder can not wick up t

solving tombstone

Electronics Forum | Fri Aug 01 00:22:46 EDT 2008 | fowlerchang

Pattern design, paste volume,printing misalignment, place misalignment,reflow process include N2 usage. All the factor above can make tombstome happen. And the most important factor is placement misalignment except design issue. But pls check the sol

solving tombstone

Electronics Forum | Fri Aug 01 02:10:26 EDT 2008 | fowlerchang

Pad design is not only the size of pad but also the distance between two pad. N2 will increase tombstone as we tested. 10 zones reflow oven and slow temperature ramp will reduce this defect. MustII is the equipment which is used to test the solderabi

solving tombstone

Electronics Forum | Fri Aug 01 00:40:06 EDT 2008 | roc2x

thanks,my pad design is 24 x 23 mils and now I chnged my stencil to 24 x 20 mils ship inwrds to lower down my volume. My placement is and part data are ok. My reflow N2 is using 1000ppm, Actual is 700-800ppm I already prolonged my pre-heat butit only

DEK repair

Electronics Forum | Sat Apr 17 17:45:52 EDT 2021 | silverlead

Hello SMTnet, Can anyone recommend a repair service for DEKs in the Midwest area?

DEK repair

Electronics Forum | Sun Apr 18 00:49:21 EDT 2021 | dekhead

I am based in TX but do service on DEKs nationwide. DEKHEAD@att.net

expired solder paste

Electronics Forum | Fri Apr 04 14:49:51 EDT 2008 | tombstone

Flux seperation is a common problem observed due to expiration of paste. The symptom is a yellow layer of flux when you open the jar. Excess flux separation will cause priting problems such as smearing and slumping.