Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Mon Nov 04 13:10:20 EST 2013 | pradeep_selec
Hi, We have an issue of 0805package Inductor falling apart from the circuit. We are not sure about the cause for the same so I would like to get suggestions from those who can share their experience / expertise. Is the pad requirement different for t
Electronics Forum | Thu Nov 07 00:52:23 EST 2013 | pradeep_selec
Any Suggestions
Electronics Forum | Sun Nov 10 16:07:31 EST 2013 | davef
First, require use of the IPC-7351B Standard as the sole basis for laying-out pads on circuit boards. Second, if someone wants to use a pad design that either: * Wasn't covered in IPC-7351B ... OR * Was for a component that was in the standard but
Electronics Forum | Tue Oct 10 14:46:35 EDT 2023 | tommy_magyar
We order bespoke carriers for some of our products, made of Durastone, however, a 1.8-2.0 mm thick FR4 sheet will do the job you require too - as previously suggested.
Electronics Forum | Wed Nov 02 15:44:52 EDT 2022 | chicagosatcom
Which SMT line brand do you recommend for a new manufacturer with low-volume and low-mix? We have a new product that needs to be made locally and requires more flexibility and responsiveness than local CMs can provide. Does any particular SMT brand
Electronics Forum | Fri Jan 22 17:39:12 EST 1999 | chang hong lin
Does anybody have information on the minimum spacing required between BGAs (i/o counts close to 696)to avoid damage during rework? Also, on the keep out requirements between CSPs (o.5 mm pitch); between CSPs and BGAs. thanks in advance for your hel
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