Electronics Forum: resin core (Page 1 of 3)

Cored Solder Wire & Supplemental Flux compatiblility

Electronics Forum | Fri Jun 25 12:19:52 EDT 2010 | operator

I have always been under the impression that you want the flux make-up of your cored wire and supplemental flux (squeeze bottle) to be as identical/compatible as possible. I was just looking over a manufacturers datasheet for a resin-based cored wir

Re: Laminate base material

Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F

Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr

Etchback

Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef

When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control

Re: Bow and Twist of PCB's

Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon

| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

Re: T sub g

Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon

| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb

Rosin vs. Resin Flux

Electronics Forum | Fri Jun 01 17:31:17 EDT 2007 | gsala

Thanks Patrick, also IPC-HDBK-001 explains even better then IPC-J-STD-004, but unfortunately not yet infos about flux for L-F soldering.That's why I am trying to get some infos more from experienced people. Some L-F (SAC or SACX) cored wires vendor

Re: Repair of SMT boards...a question!!

Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F

| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |

Rosin vs. Resin Flux

Electronics Forum | Thu May 31 10:52:31 EDT 2007 | patrickbruneel

A solder wire classified as L0 under IPC J-STD-004 means that the flux residues can be left on the board safely, and when you select this type of cored wire the intention is not to clean. You just select a solder wire that gives you an acceptable lev

Re: T sub g

Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon

| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han

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