Electronics Forum | Sat Feb 12 09:38:39 EST 2005 | primus
I think you may be assuming that our operators aren't already doing that. We need to be able to bypass the interlocks... how do you think our operators make line adjustments? Step the machine, drop the tooling, and eyeball it. That's it. The operator
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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