Electronics Forum | Tue Aug 10 15:07:41 EDT 2004 | jbabson1
This could also be caused by a bad PD. What vision are you using for the Resistor Networks? I am assuming the you are talking about small flat packs about 3.3mm x 1.6mm? I use vision type 12 and just use the body size. (wide view). And 100% cam speed
Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs
Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire
Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii
It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put
Electronics Forum | Wed Jan 23 12:13:38 EST 2002 | barryg
We have some pcb assy's that are panelized and very narrow brds. We feel that some of the smt resistors may be becoming cracked when breaking them apart. Though we are scoring them deeper here and have requested our brd house to score deeper, is ther
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Wed Nov 25 12:33:16 EST 1998 | Scott Snider
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Sun Dec 03 15:35:44 EST 2000 | Michael Nguyen
Wow. And I thought I was the only one having problem with ceramic capacitors.I too am having problem with cracking ceramic capacitors 1206 package.We changed vendors and still having the same problem. I had to reverify my entire process and I had to
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Thu Jul 20 13:57:04 EDT 2000 | Boca
I am not answering for Techguy2000, but I am chiming in here, I have the same problem. Our resistor packs are ceramic body with no leads, they have a metalized area reminicent of the old castelation leads of year gone by. The lead pitch is 50 mil
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