Electronics Forum | Mon Feb 25 07:59:47 EST 2002 | Jim Mills
Customer has requested a custom CBGA pakaged resistor network.I've seen a lot of info about TCE mismatch but aslo have heard that using 0.025-0.030 balls offers some stress releif which allows for the TCE mismatch to become less of a problem. Would
Electronics Forum | Wed Sep 28 01:32:15 EDT 2005 | Mika
Try vision type 12 for capacitors, this will give you much better acceptance in the vision inspection, since those are slightly rounded. Resistors works normally fine with vision type 10. If you have a component that is very hard to get pass the visi
Electronics Forum | Thu Sep 24 17:00:03 EDT 2009 | dogsbody
would any body be able to supply me with infomation on how to adjust a quadalign unit,as a unit on my line will not pick up 0603 resistors,but will pick up thicker 0603 caps. My manuals offer no help.I have run the aligner calibration with the cone t
Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
Electronics Forum | Wed Aug 07 18:18:08 EDT 2019 | slthomas
We mostly do it by package and/or functional description. Certainly you should be able to ignore any passives (chip caps, resistors, diodes), and plastic bodied ICs and SOTs which will cut down the research dramatically. Beyond that, we mostly jus
Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef
So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
Electronics Forum | Wed Feb 05 05:29:33 EST 2003 | Rajinder Sharma
If you are facing problem of craked capacitor only after breaking of the panel into individual PCB's, this may be due to stress being generated on the capacitors terminals. The stress may be due excess pressure being applied on the panel for breaking
Electronics Forum | Tue May 02 16:37:57 EDT 2006 | bhall
I have experienced the exact same problem with excess solder touching the plastic component body. The solution in my case was simply to replace the stencil. I was using a reusable stencil frame that had been worn out. I replaced the stencil with a so
