Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika
Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y
Electronics Forum | Thu Jun 30 13:07:56 EDT 2022 | emeto
I have used Bi based solder pastes before. What I can say about them is that they are brittle. Joints were cracking easily. This product is something new on the market, so it might be better. Keep in mind to test it for dropping and vibration and joi
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Wed Jan 26 12:22:52 EST 2000 | Mikel Rodriguez
The diode doesn�t appear completely broken. It takes a bit white color (cristal break, I think), instead of the normal red/orange. It works like a 20K-200K ohm resistor. !The diode can be working properly and sometimes change to bad! I think it may
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Fri Jul 04 21:09:04 EDT 2003 | ramanandkini
I have a CEM-1 PCB board with 35 microns copper. This is PCB is finished with SMOBC+HALS. We do solder SMT LEDs, but till date we do not have problems that you have listed. The LEDs are good & bright. It even passed high & low temp cycle tests (-40 t
Electronics Forum | Sat Jun 12 10:46:32 EDT 1999 | Dean
| Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manufac
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F
| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo
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