Electronics Forum | Mon Dec 04 12:35:11 EST 2006 | Rob
Hi AJ, Issues we have seen: Test houses not explaining results adequately/customers with their own XRF equipment not sure what they are looking for, resulting in lots of goods in rejections/requests to return stock mostly centered around: 1) Lead
Electronics Forum | Thu Dec 16 14:50:49 EST 2010 | rway
What Derek means is, you will have to train new templates from time to time, something you have to do with every AOI. Because there is no established method for marking parts, these markings can change. For instance, the text on chip resistors coul
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Wed May 10 12:13:16 EDT 2006 | scombs
We have a 6 up panel with a 1206 part .082" from the board scoreline. After depanelization when we run the board through ICT it fails for a short at that location. We have visually inspected at high magnification for any cracks in the body and at the
Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson
I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha
Electronics Forum | Tue Nov 24 13:51:23 EST 1998 | Michael Allen
What kind of "slice and dice machine" do you use? I assume you're referring to what I call a score-breaker -- a device to separate the board from the panel (or from the adjacent board) by crushing the score-line WITHOUT bending the panel or the boar
Electronics Forum | Wed Feb 10 21:41:54 EST 2010 | plaiming
We experiences some failures on PCB assemblies from the field when a methacrylate epoxy adhesive was used to secure some through-hole components to pcb board as reinforcement against vibration. During application, the epoxy covered some smaller SMT c
Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine
All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
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