Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling
CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function
Electronics Forum | Thu May 13 17:31:48 EDT 2021 | bandjwet
We have a PCB rework dilemma involving a reflow profile. This is a SAC305/Low Solids (aka no clean) process where we are currently hand soldering (5) components that were DNP. The boards have an acrylic coating and we take off the acrylic at the par
Electronics Forum | Fri Jun 15 13:46:03 EDT 2001 | Scott D
Igmar, I would check a couple of things. First, check to make sure your oven profile is acceptable. You do not want to shock the parts. Second I would check to see if the parts are breaking in a consistant pattern. Are they always split at the
Electronics Forum | Wed Dec 13 11:24:08 EST 2000 | Wolfgang Busko
Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what
Electronics Forum | Wed Dec 13 11:24:10 EST 2000 | Wolfgang Busko
Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what
Electronics Forum | Tue Jun 16 09:15:56 EDT 1998 | Justin Medernach
| We are very concerned about microcracking in SMT P&P process. I want to know something about: | What is microcracking? | When did it occur? What are the causes? | How can avuid this phenomena? Toni, Micro cracks can be caused by a ton of conditions
Electronics Forum | Thu Sep 15 11:28:11 EDT 2005 | LeeHoMa
hi Steve/Pete, Thank for your email to affirming our current mounting and soldering flow! In fact, I also don't see any problem for the pilot run(though in small volume - 500pcs). However, the problem is - I am challenged by my customer that the AI
Electronics Forum | Thu Jun 17 10:37:42 EDT 1999 | Brian Wycoff
| | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
