Electronics Forum | Wed Apr 26 10:33:57 EDT 2006 | Carol Stirling
Hi Russ, The board was ran in two orientations but with poor results. The same area of the BGA failed. I was advised today that the Process Engineer here has come to the conclusion the defect is Pick and Place machine oriented, not a process/pro
Electronics Forum | Thu Aug 01 05:25:26 EDT 2019 | ameenullakhan
Hi , hope below information may help you. The presence of small voids in thermal pad region is not likely to result in degradation of thermal and electrical performance The combing of smaller multiple voids up to 50% of the thermal pad area, does
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Thu May 09 10:12:08 EDT 2013 | wahahasteven
this is one of my project. I have tried to remove coating only on those areas with alcohol and thinner, then program the machine to coat the removed area again. But the result obviously shows that two different tones of coating on the board. I also
Electronics Forum | Fri Jan 04 07:44:37 EST 2019 | bane016
Try to measure the profile again by datasheet..with the result that you will reduce the temperature in the areas below...increase the upper temperatures as needed according to the properly measured profile...I hope you can solve the problem like this
Electronics Forum | Thu Jul 15 16:29:49 EDT 1999 | Charles Morris
We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow profi
Electronics Forum | Mon Jun 19 05:38:13 EDT 2000 | Jacqueline
Could someone please direct me to a web site or advise me on particular papers to look at which cover the topic of electrical faults (open circuits) resulting from BGA process problems. Pointers to what areas to look for during x-ray etc. Any advice
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Mon Mar 17 18:37:59 EDT 2008 | aqueous
We manufacture both bulk and localized ionic contamination testers. My answer is from the perspective of the cleanliness testing method. The issue with all bulk ionic contamination testers (Ionagraph, Omegameter, Zero-Ion), is that they test the en
Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
