Electronics Forum | Fri Jan 31 13:41:04 EST 2003 | MA/NY DDave
Hi Have you compared Retest to 2nd Retest. You might be having a contacting problem. Do Retest and 2nd Retest close together in time YiEng, DDave
Electronics Forum | Wed Jan 10 13:03:50 EST 2007 | aj
We also took the shields off one of the boards and retested and it still fails...
Electronics Forum | Wed May 29 14:36:15 EDT 2002 | blnorman
If you have a specification for the flux, you can retest all the parameters to see if they still comply. Check with Alpha to see if they have a recommendation. Our adhesive suppliers recommend running a lapshear to recertify, so the flux manufactur
Electronics Forum | Wed May 29 22:09:59 EDT 2002 | davef
Retesting is reasonable, but using paste the has an expired shelf life is dicey biz. * Use fresh paste * Buy in small containers Sure it's expensive to toss, but the price you pay in rework and defective product may be higher.
Electronics Forum | Fri Jan 31 12:13:31 EST 2003 | TN
We are having an issue with repeatability and reproduceability in our ICT process. The first pass yield is low but the retest yield is significantly higher. Has anyone out there have done a Gage R&R in their ICT process?
Electronics Forum | Thu May 30 11:21:08 EDT 2019 | slthomas
100% visual inspection. If we test, then we retest (assuming this is a completed board). Also, if there is an accelerometer on board, we argue about whether or not we should replace it by default.
Electronics Forum | Thu Jul 19 08:04:04 EDT 2001 | dahsr
I have a sealed and refridgerated 350g jar of solder paste (water soluable flux). According to the label it expired July 1st. 2001 after the 6 month shelf life. Can this be used? Why or why not? What is the relevance of the expiration date? Can I re-
Electronics Forum | Mon May 22 23:29:11 EDT 2006 | fordf1502004
I am currently using a sanyo V850 machine. We are haveing problems with the upline and downline communication from the sanyo to any other conveyor. The conveyors we have on hand all use smemma, and the sanyo has an adapter box that connects to the sm
Electronics Forum | Wed Mar 01 17:09:51 EST 2000 | Dave F
Gwen: Failures occur during a products life cycle, as you say. According to Reliability Analysis Center, overall factors affecting reliability are: � Maintenance shop (17%) � Hardware reliability (16%) � Retest OK (28%) � Design (21%) � Quality (18
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
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