Electronics Forum | Thu Jun 20 08:16:29 EDT 2002 | davef
Tell them that you use the "Abreviated Bake Method". Seriously, how do know if you've ruined the BGA {or someother component] or not? How do KNOW it worked fine?
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Wed Jun 19 08:51:49 EDT 2002 | davef
Try this: * Remove PTH components that cannot resist baking like, plastic sockets & electrolytic capacitors. [NOTE: It may be econonomic to sacrifice some of the PTH components that cannot resist baking.] * Bake the board. * Remove, reball, and repla
Electronics Forum | Thu Sep 04 06:58:46 EDT 2008 | davef
If you plan to reuse the BGA, you probably should bake the moisture from the component prior to removing it from the board.
Electronics Forum | Thu Jun 20 04:53:13 EDT 2002 | hany_khoga
Thanks Dave but unluckily my sweet BGA�s are surrounded by plastic connectors with hundreds of pins. Also my PCB�s are 4-layers so just thinking of doing what you suggest means ruining them for me. To be honest I tried bypassing the baking issue bef
Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Thu May 30 13:46:00 EDT 2002 | davef
Consider NOT getting involved in those little POS chunks of sheet metal. * They're expensive. * You never have the one you need. * Even if you DO have the item you need, you probably will not be able to locate it. * It's all but impossible to c
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Fri Dec 12 02:11:35 EST 2014 | acepa
We have 6,000 TI BGA's to remove from a PCBA and reball for reuse. TI DaVinci BGA, DIG, Media, 284 ball part number TMS320DM8148SCYEO Does anyone have a formal repair procedure or knowledge of such rework for such a part they would be willing to sh
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
