Electronics Forum: rework adhesive (Page 1 of 8)

SMD adhesive

Electronics Forum | Thu Sep 01 01:43:12 EDT 2005 | adlsmt

This is a bad situation and if you use (better to rework) adhesive that means it will work worse in your normal process(wont hold). Heat all the leads to reflow temp, twist (rotate)the part untill it breaks free. Most adhesives are not designed for t

Conductive adhesive

Electronics Forum | Wed Aug 19 06:40:06 EDT 1998 | G Thomas

Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. Must be resistant to solvents such as MEK and acetone. Cure below 150C, with possible potential for rework of the conections.

Re: Conductive adhesive

Electronics Forum | Thu Aug 20 09:19:19 EDT 1998 | JUSTIN MEDERNACH

| Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | Must be resistant to solvents such as MEK and acetone. | Cure below 150C, with possible potential for rework of the conections. MR. T

Re: Conductive adhesive

Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo

| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.

Re: Conductive adhesive

Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach

| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Tue May 25 10:56:12 EDT 1999 | John Thorup

| | | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the bo

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW

| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar

BGA rework using Tacky Flux

Electronics Forum | Sat Jan 14 06:38:04 EST 2006 | DannyJ

Hi Ken, Good question, and I did search for what you are asking, but unable to find anything conclusive about using tacky flux vs. solder. In reliability, it depends on which section of the process you are talking about. Mainly (and there are sev

Re: conformal coating after rework

Electronics Forum | Fri Jan 22 14:31:14 EST 1999 | Dave F

| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c

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