Electronics Forum | Thu Feb 03 15:44:48 EST 2000 | Rob Douglass
Looking for opinions out there regarding the use of I.R. vs. Hot Air for BGA removal and replacement. Thanks for your input.
Electronics Forum | Thu Aug 13 09:06:47 EDT 1998 | John D. Devor
Does anyone know where or who I can contact to purchase replacement parts for the M&M Products HG7900 Hot Gas Rework Station? Thanks, John D. Devor
Electronics Forum | Mon Apr 19 15:16:56 EDT 2004 | wgaffubar
Thanks, but the site will only allow you to access the information if you attended the conferance. Sound interesting. arcandspark
Electronics Forum | Tue Jan 11 13:38:40 EST 2005 | dorklover664
I go with hot air. If that isn't possiable than I would say run a test. Reflow one board and see what happens. If it gose bad all the through-hole might have to be taken out. Let us know how it gose. Megan
Electronics Forum | Tue Mar 28 17:45:49 EST 2006 | mikecollier
We profiled the BGA, drilled into center and outer balls. Original profile done this way was not hot enough when we actually tried the run, which is why the area engineer began to review and modify the recipe. And I am very sure the balls are 63/37
Electronics Forum | Tue Jan 03 11:30:13 EST 2012 | ppcbs
Try using Chip Quik to reduce the heat required for component removal. Along with your bottom pre-heater, use a temperature controlled hot air system to help heat up top side for component installation. http://www.pcb-repair.com/products.htm
Electronics Forum | Fri Dec 01 14:55:51 EST 2017 | kojotssss
Rework said that with hot air gun, heated the solder paste comes out of the middle part out to the side terminals and soldering extending beyond is perfect.
Electronics Forum | Sat May 15 20:32:55 EDT 2021 | dunks
Could you setup bga rework style machines with custom nozzles? Assuming your manual convection process consists of technicians with hot air pencils, and depending on part locations, this could potentially replace the manual part of that process.
Electronics Forum | Sat Jun 05 13:55:14 EDT 2021 | ppcbs
With a reflow oven or BGA Rework Station I doubt you will get better than 2.5 minutes. Using a hot air pencil with about a 1/4" nozzle you can probably get 30 to 60 seconds depending on the density of your PCB?
Electronics Forum | Thu Sep 23 20:23:58 EDT 1999 | Dave F
Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by co
