Electronics Forum | Mon May 12 09:36:05 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FBGA memory chip (to be replaced) and an exposed-die FBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with the
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Thu Mar 06 10:43:49 EST 2008 | samir
Folks, what is the industry consensus? Which is the more popular lead-free, flat finish these days? Here's what I know from my experience. IAg: 1. Quality of finish is dependent on supplier 2. Can NOT be reworked. It is known that reworking t
Electronics Forum | Tue Aug 10 11:12:27 EDT 1999 | Steve_S
| Folk's, | | I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. | I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this
Electronics Forum | Wed May 26 15:02:40 EDT 1999 | Paul Bonstrom (SGI)
Looking for help in finding suitable high temp gasket for use in smt assy support application. Gasket used to restrain flex on smt module in area prone to localized heating due to nearby device removal (hot air). Current gasket mtl (neoprene) degra
Electronics Forum | Thu Jan 01 13:04:42 EST 1998 | scott cook
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Fri Mar 08 11:44:00 EST 2002 | poirot
I manufacture industrial ink jet printers. I have a new application to join an unpopulated flex circuit to a light ly populated PCB. Production requirements are rather low. The area To join is 300 solder balls on the flex occupying an area of 5/8 i
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Fri May 23 16:38:28 EDT 2008 | wayne123
Well if you are getting bridges under, one thing that we used to do was flood the part with flux and then run it back through the reflow. Keep in mind we were not a High reliability manufacturer. This practice didn't hurt OUR boards, and most of the
