Electronics Forum | Thu Jul 31 15:29:25 EDT 2003 | bcceng
A couple of things you can look into 1. The proper bottom pre-heat of board. If you are applying only direct hot air to BGA without preheating can cause BGA's to warp and collapse un-even. 2. Moisture on you BGA's. If BGA's were not properly packa
Electronics Forum | Wed May 30 11:08:39 EDT 2007 | bartlozie
If you are use to this kind of work, you can repair/replace these components with a simple hot air blower, (�100) Get a good air and temperature controlled hot air blower, and a skilled operator, mount a thermocoupler on a testboard, and learn the t
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Mon Sep 21 10:49:05 EDT 1998 | Ben Salisbury
| | I am looking for a small benchtop rework station for replacing bad QFP132's as well as a variety of SO8 to SO20 components and 1206 chips. I've been looking into some IR heating equipment as well as hot air tools, but have little experience with
Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron
Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled
Electronics Forum | Sun Sep 20 17:54:26 EDT 1998 | Wayne Bracy
| I am looking for a small benchtop rework station for replacing bad QFP132's as well as a variety of SO8 to SO20 components and 1206 chips. I've been looking into some IR heating equipment as well as hot air tools, but have little experience with s
Electronics Forum | Tue Sep 25 14:25:30 EDT 2001 | davef
Points in response are: * Microstencils work fine with paste, although they are a little fussy to use. * Never have used microstencils for flux. * Like Hussman, we dab the uBGA into a puddle of tacky flux and then place it on the board. * On contro
Electronics Forum | Mon Apr 19 03:19:43 EDT 2010 | cunningham
What do other people use to ensure that the BGA machine is within spec ie beform a weekly check and record on SPC charts? We want to start recording this can a plate or some kind of surveyor be used on the machine ?
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
