Electronics Forum | Fri Jul 28 09:03:23 EDT 2006 | nodlac
Lets not forget Chemistries... Pastes, flux, solder, glue, underfil, Mask. Someone with manufacturing experience. Cant forget Soldering irons and rework oh oh...and an X-ray.
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Mon Mar 08 08:13:25 EST 2004 | Chris Lampron
Good Morning Vijay, It sounds like the PCB is getting too hot at rework. Is there any way to attach a thermocouple to check actual temps? This would give you an idea if it is your process or your PCB. Good Luck Chris
Electronics Forum | Fri Nov 09 10:25:43 EST 2001 | steven
is it all right to reflow a BGA using a rework station but without applying a layer of solder paste on pcb. the diameter of the solder ball is 0.75 and the pitch is 1.5mm.
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Fri Mar 30 09:23:22 EDT 2007 | JD
I agree completly. When the techs in the factory bring boards to me for the PCB operators to replace BGAs on I ask lots of questions before releasing it to PCB dept. Many times its a guess on the techs part because they are frusterated with troublesh
Electronics Forum | Thu Apr 01 11:27:17 EST 2004 | Jimmy
I have some fine pitch QFP's to rework with our smt rework system (forced air). There are no intitial concerns in removing the component (we havent actually begun the rework process) however, installing a new chip presents a problem. The QFP has
Electronics Forum | Tue Mar 09 19:40:47 EST 2004 | Vijay
The shorts happen at corner of the BGA. The PCB thickness is 1.6mm, It is a PC motherboard with all thru hole connectors mounted on.The preheating is done using IR heater and the temp is 120-160 for about 70-80 sec.I am using ERSA IR550A
Electronics Forum | Tue Mar 09 19:40:55 EST 2004 | Vijay
The shorts happen at corner of the BGA. The PCB thickness is 1.6mm, It is a PC motherboard with all thru hole connectors mounted on.The preheating is done using IR heater and the temp is 120-160 for about 70-80 sec.I am using ERSA IR550A
Electronics Forum | Fri Mar 30 14:47:27 EDT 2007 | GS
MSL 3) By SAM (Scanning Acoustic Microscope) before to remove them from PCB, you could identify if de-laminated or not and the degree of delamination. Best Regards...GS
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