Electronics Forum | Wed May 19 14:09:29 EDT 1999 | JohnW
Wendy, I've done this before using a machined piece of FR4 material to hold the board (machined like a DEK plate )in place at the press . It ensures that the boards are alway's in the right place and that none of the components are damaged..also sto
Electronics Forum | Thu Nov 27 16:55:31 EST 2003 | johnwnz
Hi Folks, trying to track down if there is a std for the max number of track repairs that you can don on a PCB. IPC 610 gives me an indication of what is acceptable in term's of the amount of damage I can have on a track before it's a fail however n
Electronics Forum | Wed May 29 15:29:41 EDT 2002 | zanolli
Hello Peterson, If the contact tails protruded enough on the underside of the PCB, then you could do a "reverse" press fit. I do not believe that to be the case with the VHDM. Placement equipment is out of my bailiwick but; Usually small SMT connec
Electronics Forum | Mon Sep 22 22:19:16 EDT 2003 | Dean
Questions: 1. Is this a retail product sold as PCB only? Or is this in a finished chassis / case (like an external modem)? 2. Are the customers damaging only the BGA devices? Like prying them up with a screw driver? What? You can dam and fill
Electronics Forum | Sat Sep 11 10:51:59 EDT 1999 | JohnW
Folk's, Been asked / told by my boss to look into our board prepping area for wave soldering and find another way of doing it. Thing's I'm looking at are: PCB Breakout - do you do it before or after wave Connector's that need to be pressed in due to
Electronics Forum | Thu Sep 23 20:57:13 EDT 1999 | Dean
| Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Wed Oct 06 08:49:22 EDT 1999 | Mark
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Mon Sep 27 12:19:19 EDT 1999 | John
| | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near
Electronics Forum | Thu Jul 15 14:18:24 EDT 1999 | Gord Wait
I'm designing a board where the parts will only fit if I do one of the following: 1. Put BGAs on both sides 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA parts. Can
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