Electronics Forum | Thu Oct 14 04:28:29 EDT 1999 | Grace Chua
Hi there, I have quite a number of problematic bd due to warpage problem. I would like to know the method on how to measure PCB warpage, thus to decide on the dispositon of these boards. Another question, can these warp bd be rework/fix. Is there
Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney
Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t
Electronics Forum | Thu Oct 14 18:25:29 EDT 1999 | JAX
Grace, You can get the information you need from IPC. Measuring board warpage is covered in theie 610B manual. It will let you know the what can be reworked and what cannot.
Electronics Forum | Wed Jan 20 20:42:08 EST 1999 | Tony A
| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark
I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it
Electronics Forum | Thu Mar 18 16:39:14 EST 2004 | Jed Johnson
A few good points have been made here: The profile could be ramping too fast. The profile could be gettting too hot. The profile may need to have more "soak" time before reflow to allow the board temperatue to equalize and the board to "relax" and st
Electronics Forum | Wed Nov 01 18:20:29 EST 2000 | massimo
Thank you Wolfgang, I've found something usefull in the thread, even if unfortunately nobody talks about the design of the nozzle. About the warpage, I clearly see the warpage of the corners of the BGA. To avoid it I'll keep the temperture of the nit
Electronics Forum | Wed Nov 01 08:02:16 EST 2000 | Wolfgang Busko
Massimo: Do you encounter or see warpage of the device or the PCB, I think I remember that there was a thread about this topic of shorts of the corner pins of BGA. You might try the archive. Wolfgang
