Electronics Forum | Thu Dec 03 12:43:38 EST 1998 | Ryan Jennens
| | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. | | An
Electronics Forum | Tue Apr 10 08:37:36 EDT 2018 | davef
Hi Steve ... I found nothing in the manufacturers "paper" to help. Comments are: * I agree. No blobs. Solder on the thermal pad should me minimized. Too much solder will float the component. Old timers used to talk about 50-80% coverage. * If you'
Electronics Forum | Thu Oct 22 15:10:00 EDT 1998 | Chris Fontaine
| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX
Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick
Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Wed Oct 21 09:43:40 EDT 1998 | Stefan Witte
You'll not find any solvent, which removes cured epoxy and not attack the board material as well. If there are traces underneath the surface mount components even mechanical removal of the epoxy may mess up your boards. As a mechanical tool I recomme
Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Mon Aug 22 11:54:59 EDT 2011 | blnorman
A good epoxy should work. Removal would require damaging the board, component, what ever it is attached to. I know Hardman makes a bi-pack ambient cure epoxy that we used in the lab. Search the web for epoxy suppliers, they'll offer various cure s
Electronics Forum | Mon Sep 22 21:41:51 EDT 2003 | adlsmt
There are some flexible epoxies which will not cause mechanical damage during thermal expansion and contraction but as noted above, you can not get them off to do re-work. Find one you can get off, please let me know.
Electronics Forum | Tue Aug 23 06:59:26 EDT 2011 | headlad
We use a 2 part epoxy from DEVCON it's listed as 5 minute FR 2 part epoxy. We have used a lot of the material with excellent results, specifically for security reasons.
